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MC32X系列固晶焊线AOI检测设备
2024-08-23 00:00
适用于半导体封装D/B后及W/B后两个站点的外观检测，可检测项目包括芯片偏移、表面缺陷、脏污、崩边、划伤等，第一焊点和第二焊点偏移、断线、错线、翘线等。可应用于MEMS、LDE、存储、光通信、功率IC等固晶、焊线后检测。
Suitable for appearance inspection of two sites after D/B and W/B of semiconductor packaging. The detectable items include chip offset, surface defects, dirt, edge breakage, scratches, etc. The first and second solder joints are offset, broken, misaligned, and curled. Can be applied to MEMS, LDE, storage, optical communication, power IC and other solid crystal and wire bonding post detection.
级联定位，封装精准
先进封装基板与芯片偏差，级联式顺序定位。
Advanced packaging substrate and chip deviation, cascaded sequential positioning.
模板划定，金线自检
元件种模板区域划定后，自动生成金线检测区。
After the template area for component types is defined, a gold wire detection area is automatically generated.
图像融合，精准提取
多通道的图像融合，匹配精准目标提取算法。
Multi channel image fusion, matching precise target extraction algorithm.
快搭检测，应对自如
应对各类半导体 Die Bond、Wire Bond、 Clip Bond后检测环境的快速搭建。
Quickly set up post testing environments for various semiconductor Die Bond, Wire Bond, Clip Bond.
一键判定，标准自选
绝对式/相对式 NG 判定标准，供客户一键选定。
Absolute/relative NG judgment criteria, available for customers to select with just one click.
金线金球，自动分割
自动分割金线金球，操作便捷。
Automatic segmentation of gold and gold balls, easy to operate.
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